System-level applications with integrated on-chip lasers Wed, Jun 1 2022 - Wed, Oct 1 2025 system-level on-chip laser From the system-level, we plan to develop PICs with on-chip lasers for applications of communications and interconnects, OPA-based LiDAR, Bio-chemical sensors, quantum information processing and optical computing, etc.
Heterogeneously Integration Fri, Jun 1 2018 - Wed, Oct 1 2025 QD laser heterogenouse integration Heterogeneous integration bonds unpatterned III-V thin films to silicon wafers at the early- to mid-stages with a coarse alignment, and then define devices lithographically on the full wafer scale.
Microcavity devices Sat, Jul 1 2017 - Wed, Oct 1 2025 laser microstructure By light confinement in small volumes with resonant recirculation, microcavity lasers promise to complement the rise of Si photonics by populating these chips with extreme small size.
Monolithic integration with QD active medium Sat, Jul 1 2017 - Wed, Oct 1 2025 QD laser monolithic integration Direct epitaxial integration of III-V optoelectronic devices on Si offers a substantial manufacturing cost and scalability advantage over heterogeneous integration via wafer bonding.
